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Multi Chip Module Ball Grid Array buy in San Antonio
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Multi Chip Module Ball Grid Array

Multi Chip Module Ball Grid Array

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The need for high density, high performance, and cost effectiveness has sped up the development and use of multi-chip modules. Multi-chip modules enable the integration of different chips with varied functions into a mini substrate, instead of inserting individual packages onto a large PCB (also known as second level packages)

i2a's MCM-BGA (Multi-Chip Module Ball Grid Array) assembly employs the latest IC packaging technology for high-density products. MCM-BGA provides exceptional electrical and thermal performance coupled with its affordability enable system designers to integrate several devices into a single IC package.

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Multi Chip Module Ball Grid Array
Multi Chip Module Ball Grid Array
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