Multi Chip Module Ball Grid Array
In stock
Reconfirm the price with seller
- Customer pickup,
- Courier
- In detail
Products of other enterprises
Description
The need for high density, high performance, and cost effectiveness has sped up the development and use of multi-chip modules. Multi-chip modules enable the integration of different chips with varied functions into a mini substrate, instead of inserting individual packages onto a large PCB (also known as second level packages)
i2a's MCM-BGA (Multi-Chip Module Ball Grid Array) assembly employs the latest IC packaging technology for high-density products. MCM-BGA provides exceptional electrical and thermal performance coupled with its affordability enable system designers to integrate several devices into a single IC package.
Contact the seller
Multi Chip Module Ball Grid Array
We recommend to see